Double-sided hybrid high density circuit board and method of mak

Details Double-sided hybrid high density circuit board and method of mak Double-sided hybrid high density circuit board and method of mak

1989-06-28

1991-12-10

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

29830, 29846, 174255, 361414, H05K 100

Patent

active

050720759

ABSTRACT:
A very fine line three-dimensional package is constructed without lamination during construction of the signal core. Construction of the signal core employs a method of line and hole formation and planarization without drilling, and avoids imposing excessive stress on the package during its assembly. In forming the three-dimensional structure, a power core which may comprise a single or multiple layers is manufactured in the conventional method using a very high dielectric constant material.
A signal core is on both sides of the power core, using a sequential approach with a low dielectric constant material. The method comprises utilizing photoresist techniques to define the regions of horizontal lines running parallel to the surface of the power core substrate and vertical posts running perpendicular to the surface of the power core, as each layer of lines and posts is established. After metallization of the lines and posts, the dielectric is flowed over the pattern of lines and posts to form a finished layer of the signal core. The sequence is repeated as many times as necessary to build up the required wiring pattern in the signal core. Layers of signal core are built up sequentially on both sides of the power core by alternating between depositing conducting metal and flowing and solidifying a dielectric in place.

REFERENCES:
patent: 3934335 (1976-01-01), Nelson
patent: 4372804 (1983-02-01), Hanabusa et al.
patent: 4420364 (1983-12-01), Nukii et al.
patent: 4480288 (1984-10-01), Gazdik et al.
patent: 4522667 (1985-06-01), Hanson et al.
patent: 4566186 (1986-01-01), Bauer et al.
patent: 4612083 (1986-09-01), Yasumoto et al.
patent: 4640866 (1987-02-01), Suzuki
patent: 4679122 (1987-07-01), Belke, Jr. et al.
patent: 4689110 (1987-08-01), Leibowitz
patent: 4710854 (1987-12-01), Yamada et al.
patent: 4754371 (1988-06-01), Nitta et al.
patent: 4755911 (1988-06-01), Suzuki
patent: 4770922 (1988-09-01), Hatakeyama et al.
patent: 4781969 (1988-11-01), Kobayashi et al.
patent: 4791239 (1988-12-01), Shirahata et al.
patent: 4803450 (1989-02-01), Burgess et al.
patent: 4806188 (1989-02-01), Rellick
patent: 4811082 (1989-03-01), Jacobs et al.
patent: 4816323 (1989-03-01), Inoue

Affiliated with

Also associated with

Rating

Double-sided hybrid high density circuit board and method of mak does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Double-sided hybrid high density circuit board and method of mak, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Double-sided hybrid high density circuit board and method of mak will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1042481