Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1995-09-25
1997-03-18
Thomas, Laura
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174262, 361749, 361767, H05K 100
Patent
active
056125119
ABSTRACT:
A double-sided electrical interconnect flexible circuit particularly useful for ink-jet pens and a method for assembling an ink-jet pen with the flexible circuit is described. A wide web, dielectric, flexible tape, such as of a polyimide material, is used to allow the substantially simultaneous formation of redundant flexible circuits across the web. The web is laminated with a conductive material foil and a plurality of redundant circuit patterns formed on the web in a single masking and etching process, or the like. A cover layer, also of a wide web format, dielectric material is coated over the circuit patterned conductive layer. Vias are provided in both the tape under layer and the tape over layer for appropriate electrical connections whereby a first device, such as an ink-jet printer controller, can be connected through one layer and a second device, such as a replaceable ink-jet pen's electrically active components can be connected through the other layer.
REFERENCES:
patent: 4435740 (1984-03-01), Huckabee et al.
patent: 4658104 (1987-04-01), Koizumi et al.
patent: 4806106 (1989-02-01), Mebane et al.
patent: 4859806 (1989-08-01), Smith
patent: 4989317 (1991-02-01), Firl et al.
patent: 5311407 (1994-05-01), Lumbard
patent: 5388327 (1995-02-01), Beeson et al.
patent: 5442386 (1995-08-01), Childers et al.
patent: 5453913 (1995-09-01), Koyanagi
patent: 5489749 (1996-03-01), DiStefano et al.
3M-Electronic Products Division Brochure, 1993, "Two-Layer TAB & Microflex Products From #M".
3M Electronic Products Division Brochure, 1994, "Specifications: Two-Layer Thick Dielectric Tape For Automated Bonding (TAB)", pp. 1-8.
3M-Electronic Products Division, 1994, "Design Guidelines: Two-Layer Thick Dielectric Tape For Automated Bonding (TAB)" pp. 1-32.
Davis Byron K.
Meyer Neal
Hewlett--Packard Company
Thomas Laura
LandOfFree
Double-sided electrical interconnect flexible circuit for ink-je does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Double-sided electrical interconnect flexible circuit for ink-je, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Double-sided electrical interconnect flexible circuit for ink-je will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1707681