Double-sided copper-clad laminate for forming capacitor...

Details Double-sided copper-clad laminate for forming capacitor... Double-sided copper-clad laminate for forming capacitor...

2006-01-17

2006-01-17

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S612000, C428S901000, C205S050000, C361S323000

Reexamination Certificate

active

06986937

ABSTRACT:
The present invention relates to a double-sided copper-clad laminate for forming a capacitor layer, formed by adhering electrodeposited copper foils on the both sides of a dielectric layer of a thickness of 10 μm or less, and the object of the present invention is to secure good voltage resistant proprieties.For the double-sided copper-clad laminate of the present invention uses an electrodeposited copper foil provided with a matte side to be joined to the dielectric layer prepared by physically polishing the rough surface of an untreated electrodeposited copper foil obtained by an electrolysis method to a surface roughness (Rz) of 0.5 μm to 3.0 μm, and nodular treatment, and as required, passivation, silane coupling agent treatment, or the like are performed thereon. As the manufacturing method thereof, a manufacturing method wherein the surfaces of the resin layers of two electrodeposited copper foils having resin layers facing to each other are adhered, or the like.

REFERENCES:
patent: 4997516 (1991-03-01), Adler
patent: 5155655 (1992-10-01), Howard et al.
patent: 5437914 (1995-08-01), Saida et al.
patent: 5679230 (1997-10-01), Fatcheric et al.
patent: 6693793 (2004-02-01), Kuwako et al.
patent: 2001-339167 (2001-12-01), None
patent: 2002-009416 (2002-01-01), None

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