Double-sided cooling type semiconductor module

Details Double-sided cooling type semiconductor module Double-sided cooling type semiconductor module

2006-03-28

2006-03-28

Tran, Mai-Huong (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S707000, C257S712000, C257S714000, C257S718000, C257S719000, C257S720000, C361S699000

Reexamination Certificate

active

07019395

ABSTRACT:
A semiconductor module includes a fixed type and transformable type coolers and a flat semiconductor package sandwiched between the coolers. A relative positional relationship of the semiconductor package is fixed with the fixed type cooler, but variable with the transformable type cooler. The transformable type cooler includes a transformable member of a metal thin plate covering a coolant chamber. The semiconductor module includes a sandwiching mechanism causing the fixed type cooler to be pressed toward the transformable type cooler. Fastening adjustment screws of the sandwiching mechanism causes a pressing frame to approach a cooler body of the transformable type cooler. Therefore, the semiconductor package is pressed via the fixed type cooler while the transformable member is slightly transformed. This enhances a degree of contact between the semiconductor package and transformable member via an insulating member.

REFERENCES:
patent: 5323292 (1994-06-01), Brzezinski
patent: 6232151 (2001-05-01), Ozmat et al.
patent: 6542365 (2003-04-01), Inoue
patent: U-S61-33448 (1986-02-01), None
patent: A-H09-199647 (1997-07-01), None
patent: A-2001-267481 (2001-09-01), None

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