Double-side polishing apparatus

Details Double-side polishing apparatus Double-side polishing apparatus

2008-03-13

2009-11-10

Eley, Timothy V (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S008000, C451S262000, C451S267000

Reexamination Certificate

active

07614934

ABSTRACT:
The double-side polishing apparatus for polishing both faces of a wafer is capable of reliably measuring not only a thickness of an outer part of the wafer but also a thickness of a center part thereof. The double-side polishing apparatus comprises: a lower polishing plate; an upper polishing plate held by a frame; and a carrier having a through-hole for holding the wafer. A window section, through which a laser beam passes, is formed in a part of the upper polishing plate, under which the wafer held by the carrier passes. An optical thickness measuring equipment is provided to a part of the frame, under which the window section passes while the upper polishing plate is rotated. The thickness measuring equipment emits the laser beam through the window section, receives reflected beams reflected from an upper face and a lower face of the wafer, and calculates the thickness of the wafer on the basis of peak values of the reflected beams.

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