Double poly process with independently adjustable interpoly diel

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 56, 437919, H01L 218238

Patent

active

054340985

ABSTRACT:
The present invention relates to a double poly MOS structure and a method for polysilicon capacitor formation which allows for independent adjustment of an interpoly oxide layer without affecting thickness of the gate oxide layer. In an exemplary embodiment, a first oxide layer is formed above a polysilicon layer. A second oxide layer is subsequently formed on the substrate to establish a gate oxide in an active area of the transistor. As a result, the interpoly oxide layer is formed by a combination of the first and second oxide formations, while the gate oxide layer is formed by only the second oxide formation. Thus, the thickness of the interpoly oxide layer can be adjusted by increasing or decreasing the thickness of the first oxide formation without changing the thickness of the gate oxide layer.

REFERENCES:
patent: 4419812 (1983-12-01), Topich
patent: 4494301 (1985-01-01), Faraone
patent: 4577390 (1986-03-01), Haken
patent: 4639274 (1987-01-01), Krishna
patent: 4735915 (1988-04-01), Kita et al.
patent: 4987091 (1991-01-01), Kotaki
patent: 5104819 (1992-04-01), Freiberger et al.
patent: 5223451 (1993-06-01), Uemura et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Double poly process with independently adjustable interpoly diel does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Double poly process with independently adjustable interpoly diel, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Double poly process with independently adjustable interpoly diel will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2418912

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.