Metal deforming – By relatively movable offset tool-faces – With tool motion in fixed path
Patent
1995-10-23
1996-09-24
Jones, David
Metal deforming
By relatively movable offset tool-faces
With tool motion in fixed path
723896, 72381, 72413, B21D 501
Patent
active
055579647
ABSTRACT:
A bending apparatus (10) for use in bending moldings (300 and 301) having a decorative outer surface (308) is described. The bending apparatus includes an upper bending member (12) and a lower bending member (52) which are moved together to form intricate compound bends in the molding. The bending surface (14) of the upper bending member has a variable curvature which is controlled by adjustment units (38). The lower bending member includes first and second outer tool members (54 and 56) and a middle tool member (120). The moldings are mounted onto the holders (102) of the tool members during bending. The outer tool members pivot along two axis in response to the pressure of the upper bending member during bending. The middle tool member pivots along one axis and is compressed downward during bending. The bending apparatus allows double plane bends to be formed in the molding without damaging the decorative outer surface of the molding.
REFERENCES:
patent: 1276639 (1918-08-01), Finegan
patent: 1776082 (1930-09-01), Peterson
patent: 2966934 (1961-01-01), Huet
patent: 3004582 (1961-10-01), Key
patent: 3992460 (1975-11-01), Jackson
patent: 4368224 (1983-01-01), Jackson
patent: 4569219 (1986-02-01), Threlkel et al.
patent: 4975306 (1990-12-01), Jackson
patent: 5151307 (1992-09-01), Jackson
Demmer John E.
Jessop Richard E.
Demmer Corporation
Jones David
McLeod Ian C.
Moyne Mary M.
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