Double inspection of reticle or wafer

Details Double inspection of reticle or wafer Double inspection of reticle or wafer

2008-04-08

2008-04-08

Punnoose, Roy M (Department: 2886)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

C356S237500

Reexamination Certificate

active

10780374

ABSTRACT:
During mask or reticle inspection, each region is scanned at least twice, using an overlap between each pair of consecutive frames. System contamination and camera blemishes have approximately constant frame coordinates, while mask defects have constant reticle coordinates, but inconstant scan frame coordinates. True defects are detected at different coordinates in consecutive frames with a known displacement therebetween.

REFERENCES:
patent: 2003/0058435 (2003-03-01), Honda et al.

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