Double-faced adhesive film particle getter

Details Double-faced adhesive film particle getter Double-faced adhesive film particle getter

1996-06-04

1998-09-22

Davis, Jenna

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

206701, 206706, 206726, 428354, C09J 702, B65D 8586

Patent

active

058111840

ABSTRACT:
A particle getter is presented for protecting electronic circuitry from damage caused by particles or debris. An adhesive film is used to capture and retain particles, such as solder balls and wire trimmings, that pose a danger to the functioning of electronic circuitry, and thereby prevent short circuits and other malfunctions. The particle getter does not interfere with access to the circuitry, and thus may be used when conformal coating is not practicable. The particle getter is particularly useful for protecting electronic circuitry aboard a spacecraft, since particles that can cause a circuit malfunction float freely in the zero-gravity environment, where they can be captured and retained by the getter. The preferred adhesive film is space-qualified, and has outgassing properties that are within limits imposed by NASA specifications. The particle getter has applications in many places where debris is present, both in space and earthbound.

REFERENCES:
patent: 4470508 (1984-09-01), Yen
patent: 4629640 (1986-12-01), Akao
patent: 5208103 (1993-05-01), Miyamoto et al.
patent: 5277972 (1994-01-01), Sakumoto et al.
patent: 5304419 (1994-04-01), Shores
patent: 5346765 (1994-09-01), Maeda et al.
Allison, D.M., "Find Getter Analysis Report", IEEE, 1985, pp. 355-358.
Campbell, Jr., W.A., et al., "Outgassing Data for Selecting Spacecraft Materials", NASA Reference Publication 1124 Revised, 1987, pp. 1-3.
King, J., "Use of Silicone Gel Particle Getters for Microcircuit Packaging", Proceedings of the Intenational Society of Hybrid Microelectonics, pp. 1985, 322-325.
Shores, Dr., A.A., et al., "Effective Gettering Materials for Hermetic Packages", ISHM '92 Proceedings, pp. 47-51.

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