Double face polishing apparatus

Details Double face polishing apparatus Double face polishing apparatus

2007-08-08

2009-02-03

Eley, Timothy V (Department: 3724)

Abrading

Machine

Rotary tool

C451S007000, C451S262000, C451S268000, C451S446000

Reexamination Certificate

active

07485029

ABSTRACT:
The double face polishing apparatus is capable of controlling an amount of supplying slurry to a lower polishing plate. The double face polishing apparatus comprises: a lower polishing plate and an upper polishing plate; a carrier provided between the polishing plates, the carrier having a through-hole for holding a workpiece; a plate driving unit for rotating the polishing plates; a carrier driving unit for rotating the carrier; ring-shaped ducts coaxially provided to the upper polishing plate; a slurry supply source supplying slurry to the ring-shaped ducts; and supply pipes for supplying the slurry to the lower polishing plate. The slurry is supplied to each of coaxial polishing zones of the lower polishing plate via the corresponding ring-shaped ducts and the supply pipes.

REFERENCES:
patent: 5803798 (1998-09-01), Cesna et al.
patent: 6045437 (2000-04-01), Tandon et al.
patent: 6113478 (2000-09-01), Anderson et al.
patent: 2002/0056548 (2002-05-01), Nakamura et al.
patent: 11-262862 (1999-09-01), None

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