Double density fuse bank for the laser break-link programming of

Details Double density fuse bank for the laser break-link programming of Double density fuse bank for the laser break-link programming of

1997-06-20

1999-08-03

Brown, Peter Toby

Semiconductor device manufacturing: process

Making device array and selectively interconnecting

Using structure alterable to nonconductive state

438601, 257209, 257529, 337297, 3652257, H01L 2182

Patent

active

059337141

ABSTRACT:
A fuse bank for use in the laser break-link programming of an integrated circuit device. The fuse bank uses fuse elements with two ends that contain fusible regions proximate the first end and non-fusible regions proximate the second end. The fuse elements are aligned in alternately oriented parallel rows so that the first end of each fuse element is juxtaposed with the second end of any adjacent fuse element. By sequentially alternating the orientation of the fuse elements in the fuse bank, the fuse elements can be formed in a highly dense matter without bringing any two fusible regions too close to one another. Accordingly, a laser can be used to sever selected fusible regions without adversely effecting other fusible regions within the fuse bank. By alternating the orientations of sequential fuse elements, a fuse bank can be created that is twice as dense as single orientation fuse banks with only a 30% to 50% increase in size. The space savings on an integrated circuit enables more circuitry per unit space and promotes the further miniaturization of the integrated circuit device.

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