Double cavity semiconductor chip carrier

Details Double cavity semiconductor chip carrier Double cavity semiconductor chip carrier

1979-09-20

1981-09-08

Tolin, Gerald P.

Electricity: electrical systems and devices

Miscellaneous

361401, 361395, 174 52FP, 339 17R, H05K 706, H01L 2500

Patent

active

042888417

ABSTRACT:
A semiconductor device including a double cavity semiconductor chip carrier 100 which comprises a multilayer ceramic sandwich structure having a pair of semiconductor chip receiving cavities in the opposite faces thereof. The package enables mounting and electrical interconnection of a pair of semiconductor integrated circuit chips in a package of the same size as that for a single chip and having somewhat greater thickness.
External terminals 93 on an outside face of the carrier are connected selectively by metallization paths 44, 53, 55, 83 integral with the carrier to chip mounting pads 41, 51 and to internal terminals 28 within the carrier. The internal terminals are disposed peripherally with respect to the chip cavities and adapted for interconnection with chip contact pads 26. Thus, a pair of unlike semiconductor integrated circuits can be interconnected in accordance with different patterns within a single package.

REFERENCES:
patent: 3200297 (1965-08-01), Gibson
patent: 3320351 (1967-05-01), Glickman
patent: 3403300 (1968-09-01), Horowitz
patent: 3579046 (1971-05-01), Jordan
patent: 3588852 (1971-06-01), McCormack
patent: 3777220 (1973-12-01), Tatusko
patent: 3936928 (1976-02-01), Hopp
patent: 3984620 (1976-10-01), Robillard
patent: 4038488 (1977-07-01), Lin
patent: 4167647 (1979-09-01), Salera

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