Dot heat stapling

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

1563806, 156553, 1565801, 1565831, B30B 302, B30B 1534

Patent

active

044734328

ABSTRACT:
Dot Hot Stapling is provided wherein articles such as bags can be made of interwoven or knitted plastic material and wherein the interfitting or interwoven strips are adapted to be sealed together so as to prevent unraveling and to provide an economical method of making such articles. With the present invention, crossing points of tape type fabrics are attached together with dot sealing or dot hole edge sealing by any means that will accomplish this function. The dot heat sealing may be accomplished in any of plurality of ways such as by using heated needles, co-acting rollers with heated prongs, pulsed laser, interrupted heated air jets, a pulsed spark arrangement, intermittent ultrasound, ultrasonics, or the like.

REFERENCES:
patent: 3115564 (1963-12-01), Stacy
patent: 3486957 (1969-12-01), Fish et al.
patent: 3558381 (1971-01-01), Colianni
patent: 3758371 (1973-09-01), Lang et al.
patent: 3765974 (1973-10-01), Petersik et al.
patent: 4227959 (1980-10-01), Brown
patent: 4373979 (1983-02-01), Planeta

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Dot heat stapling does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dot heat stapling, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dot heat stapling will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1768477

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.