Dopant film and methods of diffusing impurity into and manufactu

Details Dopant film and methods of diffusing impurity into and manufactu Dopant film and methods of diffusing impurity into and manufactu

1990-10-18

1992-03-10

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437163, 437164, H01L 21225, H01L 21385

Patent

active

050949764

ABSTRACT:
A dopant film contains an organic binder, an inorganic binder and a compound of an impurity element for diffusion. Both surfaces of the dopant film are coated with adhesive. Releasable sheets sandwich the dopant film. The dopant film permits automated alternate stacking with semiconductor wafers, providing an advantage of labor saving. When the alternate stacking is automated, it will become hard for the wafer breakage to occur, sharply decreasing the rate of breakage. Furthermore, since the adhesion of a semiconductor wafer improves, the variation in the diffusion depth will decrease.

REFERENCES:
patent: 3183130 (1965-05-01), Reynolds et al.
patent: 3630793 (1971-12-01), Christensen et al.
patent: 3971870 (1976-07-01), Christensen et al.
patent: 4661177 (1987-04-01), Powell
patent: 4756968 (1988-07-01), Ebe et al.
patent: 4853286 (1989-08-01), Narimatsu et al.
English Abstract for JP 54-84474, Patented 7/5/79.
English Abstract for JP 59-196380, Patented 11/7/84.
Patent Abstracts of Japan Group C270, vol. 9, No. 59, Pub. 3/15/85.

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