Domed lid for integrated circuit package

Details Domed lid for integrated circuit package Domed lid for integrated circuit package

1990-01-16

1991-11-12

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, H01L 2302

Patent

active

050649680

ABSTRACT:
An integrated circuit package includes a rectangular base, and a continuous sidewall which extends upwardly from the periphery of the base. Microelectronic circuit components are mounted on the base in a cavity defined within the sidewall. A domed lid includes a resilient central domed portion which arches above the cavity. A peripheral edge portion of the lid extends downwardly into the cavity by a small distance, adjacent to the inner surface of the sidewall. A lip extends outwardly from the edge portion and is sealingly welded at its periphery to the upper surface of the sidewall. The joint between the lip and edge portion is resilient and acts as a hinge, such that when a force or pressure is applied to the domed portion, the edge portion rotates about the hinge into abutment with the inner surface of the sidewall. This transfers a major component of the applied force to the sidewall, and resists deflection of the domed portion into the cavity.

REFERENCES:
patent: 3836697 (1974-09-01), Schultz
patent: 4126758 (1978-11-01), Krumme
patent: 4717948 (1988-01-01), Sakai et al.

Affiliated with

Also associated with

Rating

Domed lid for integrated circuit package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Domed lid for integrated circuit package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Domed lid for integrated circuit package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1014156