Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-12-28
2002-10-01
Schuberg, Darren (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S699000, C361S707000, C165S080400, C174S015200
Reexamination Certificate
active
06459574
ABSTRACT:
BACKGROUND OF THE INVENTION
Intel® SpeedStep™ Technology or other similar variable power technologies makes it possible for the processor in a docked electronic device to run at a higher frequency than when in undocked battery mode. A faster processor generates more heat and typically requires more cooling. Current practice is to design internal electronic device cooling based on maximum performance heat dissipation requirements. However, market studies indicate electronic devices are infrequently used in the high performance mode. As a result, the entire cooling solution—fans, heat sinks, etc.—are typically larger, heavier, and more expensive than warranted by typical usage models. Based on the current design paradigm, the continued escalation of system performance and power—aimed at high performance usage scenarios—will require larger onboard cooling solutions occupying a higher percentage of a finite electronic device volume. A prior art electronic device and docking station is illustrated in FIG.
1
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REFERENCES:
patent: 5870283 (1999-02-01), Maeda et al.
patent: 6021045 (2000-02-01), Johnson
patent: 6275945 (2001-08-01), Tsuji et al.
Duong Hung Van
Schuberg Darren
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