Distribution assembly for an injection molding apparatus

Plastic article or earthenware shaping or treating: apparatus – Female mold and charger to supply fluent stock under... – With means between charger and mold to cut off flow of...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C425S566000, C425S572000

Reexamination Certificate

active

07320588

ABSTRACT:
An injection molding apparatus includes a manifold having a manifold channel for receiving a melt stream of moldable material from a source and delivering the melt stream to a nozzle channel of a nozzle. A mold cavity communicates with the nozzle channel to receive the melt stream through the mold gate. A distribution assembly is located adjacent to the manifold. The distribution assembly includes at least one distribution member having a groove formed in an outer surface thereof and at least one conduit provided in the distribution member. The groove receives wiring from a heater of the nozzle and routes the wiring to a termination location or box. The conduit distributed fluid to various locations in the injection molding apparatus, such as actuation fluid for an actuator.

REFERENCES:
patent: 3024498 (1962-03-01), Bronnenkant et al.
patent: 4082324 (1978-04-01), Obrecht
patent: 4213751 (1980-07-01), Fernandez
patent: 4279582 (1981-07-01), Osuna-Diaz
patent: 4468191 (1984-08-01), Gellert
patent: 4888252 (1989-12-01), Kilim
patent: 5007821 (1991-04-01), Schmidt
patent: 5022846 (1991-06-01), Schmidt
patent: 5030084 (1991-07-01), Gellert et al.
patent: 5032078 (1991-07-01), Benenati
patent: 5227179 (1993-07-01), Benenati
patent: 5320511 (1994-06-01), Woerner
patent: 5320513 (1994-06-01), Schmidt
patent: 5352109 (1994-10-01), Benenati
patent: 5518389 (1996-05-01), Nonomura et al.
patent: 6554604 (2003-04-01), Schmidt
patent: 6729871 (2004-05-01), Sattler et al.
patent: 6824379 (2004-11-01), Doyle et al.
patent: 2002/0121713 (2002-09-01), Moss et al.
patent: 2004/0047935 (2004-03-01), Moss et al.
patent: 0 480 213 (1992-04-01), None
patent: WO-01/47684 (2001-07-01), None
patent: WO-2004/069517 (2004-08-01), None
“ezMODU System”, YUDO web-site, www.yudo.com, (Feb. 3, 2005).
“Hot Runner System Options”,INCOE Corporation Brochure, (Apr. 2004).
“Total Solution for Hot Runner”,YUDO Brochure, unknown.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Distribution assembly for an injection molding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Distribution assembly for an injection molding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Distribution assembly for an injection molding apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2798385

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.