Distributed transmission line structure

Details Distributed transmission line structure Distributed transmission line structure

1996-12-23

1998-09-08

Gensler, Paul

Wave transmission lines and networks

Long lines

Strip type

H01P 308

Patent

active

058050370

ABSTRACT:
A distributed transmission line structure (10) includes a ground plane (26) affixed to a substrate (12). The substrate (12) is formed of a generally nonconductive material. A first metallic strip (14) is affixed to the substrate (12) and is electrically connected to the ground plane (26) through a first through-hole (34). A second metallic strip (16) is affixed to the substrate (12) and is spaced apart from the first metallic strip (14) by a gap (28) and is electrically connected to the ground plane (26) through a second through-hole (38). A dielectric layer (20) overlies the substrate (12), the first metallic strip (14), and the second metallic strip (16). A third metallic strip (18) is affixed to the dielectric layer (20) and is disposed to overlie the gap (28). The third metallic strip (18) has a width less than the gap (28). The impedance of the distributed transmission line structure (10) is substantially constant over a predetermined range of thickness of the dielectric layer (20).

REFERENCES:
patent: 3093805 (1963-06-01), Osifchin et al.
patent: 3512110 (1970-05-01), Clar
patent: 4110712 (1978-08-01), Morris
patent: 5446425 (1995-08-01), Banba
patent: 5576669 (1996-11-01), Ruelke
patent: 5594393 (1997-01-01), Bischof

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