Distributed shunt structure for lapping of current...

Details Distributed shunt structure for lapping of current... Distributed shunt structure for lapping of current...

2004-11-17

2011-12-06

Nguyen, Dung Van (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S057000, C451S008000

Reexamination Certificate

active

08070554

ABSTRACT:
An apparatus and method for lapping and fabricating a read/write head is described. The lapping method includes performing a first lapping process on a structure having the read/write head fabricated therein. The first lapping process is for reducing a first resistive region. The first resistive region is located proximal to a surface of the structure. The first lapping process is for achieving a first lapping benchmark. The lapping method further includes performing a second lapping process on a second resistive region. The second lapping process laps at a rate lesser than the first lapping process. The second lapping process is for achieving a second lapping benchmark. The second resistive region is interposed between the first resistive region and the read/write head. The second resistive region has a different resistive value than the second resistive region.

REFERENCES:
patent: 5361547 (1994-11-01), Church et al.
patent: 5588199 (1996-12-01), Krounbi et al.
patent: 5761009 (1998-06-01), Hughbanks et al.
patent: 5772493 (1998-06-01), Rottmayer et al.
patent: 5911455 (1999-06-01), Draaisma et al.
patent: 6003361 (1999-12-01), Amin et al.
patent: 6193584 (2001-02-01), Rudy et al.
patent: 6532646 (2003-03-01), Watanuki
patent: 6633459 (2003-10-01), Heim et al.
patent: 6760197 (2004-07-01), Boutaghou et al.
patent: 6786803 (2004-09-01), Crawforth et al.
patent: 6884148 (2005-04-01), Dovek et al.
patent: 6935923 (2005-08-01), Burbank et al.
patent: 2002/0066177 (2002-06-01), Takada et al.
patent: 56159830 (1981-10-01), None
patent: 62099911 (1987-05-01), None
patent: 2000076630 (2000-03-01), None
patent: 2003142756 (2003-05-01), None
“Using Magneto-Resistive Head Transducers as Lapping Transducers and a Parallel Resistor System to Calculate Lapping Constants” IBM TDB, Sep. 1993, pp. 79ff.
“Electrostatic Shielding for Magnetoresistive Read Heads” IBM TDB, Apr. 1979, pp. 4459ff.
“Magneto Resistive-Sensor Protection on Wafer Level” IBM TBBD, Feb. 1996, pp. 207ff.

Affiliated with

Also associated with

Rating

Distributed shunt structure for lapping of current... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Distributed shunt structure for lapping of current..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Distributed shunt structure for lapping of current... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4257291