Distributed polishing head

Details Distributed polishing head Distributed polishing head

1991-07-05

1993-07-27

Kisliuk, Bruce M.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

511313, 51373, 51394, B24B 722, B24B 704

Patent

active

052301842

ABSTRACT:
A distributed polishing head assembly (17) has a flexible membrane (14), and a plurality of periodic polishing pads (12) that are attached to the flexible membrane (14). The polishing pads (12) are made from a flat semiconductor wafer that has been sawed into small pieces. The polishing head is rubbed against a semiconductor wafer (10) in order to planarize the wafer (10).

REFERENCES:
patent: 3579922 (1971-05-01), Mandonas
patent: 3740900 (1973-06-01), Youmans et al.
patent: 3905162 (1975-09-01), Lawrence et al.
patent: 4606151 (1986-08-01), Heynacher
patent: 4663890 (1987-05-01), Brandt
patent: 4693036 (1987-09-01), Mori
patent: 4726150 (1988-02-01), Nishio et al.
patent: 4850152 (1989-07-01), Heynacher et al.
patent: 4897966 (1990-02-01), Takahashi
patent: 4918869 (1990-04-01), Kitta
patent: 5081796 (1992-01-01), Schultz
patent: 5113622 (1992-05-01), Nishiguchi et al.

Affiliated with

Also associated with

Rating

Distributed polishing head does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Distributed polishing head, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Distributed polishing head will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2336561