Distributed interconnect

Details Distributed interconnect Distributed interconnect

2007-07-10

2007-07-10

Jones, Stephen E. (Department: 2817)

Wave transmission lines and networks

Coupling networks

With impedance matching

C333S260000

Reexamination Certificate

active

10662779

ABSTRACT:
A distributed interconnect and a method is provided for interconnecting electrical components which minimizes coupling inductance and increases bandwidth. The interconnect includes a transmission line with a first and second conductive transmission element. The first conductive transmission element is disposed between a first and second terminal, and has an impedance characteristic that increases from the first terminal to the second terminal. The second conductive transmission element is disposed between a third and fourth terminal, and has an impedance characteristic that increases from the third terminal to said fourth terminal. The conductive transmission elements are furthermore positioned in parallel alignment with respect to each other. A plurality of conductive interconnect elements interconnect the first and second transmission elements and are distributed along the first and second transmission elements and at least interconnect the first terminal to the fourth terminal and interconnect the second terminal to the third terminal. Furthermore, a first port is connected to the first terminal and a second port is connected to a third terminal.

REFERENCES:
patent: 3593174 (1971-07-01), White
patent: 4092616 (1978-05-01), Osterwalder
Ginzton et al. “Distributed Amplification” Proceedings of the I.R.E. v. 36, pp. 956-969, (1948).
Russell. “Microwave Power Combining Techniques” IEEE Transactions on Microwave Theory and Techniques, vol. MTT-27, pp. 472-478, May 1979.
Nelson et al. “Optimum Microstrip Interconnections” IEEE MTT-S Digest, pp. 1071-1074 (1991).
Fano. “Theoretical Limitations on the Broadband Matching of Arbitrary Impedances” Journal of the Franklin Institute, vol. 249, pp. 57-83 (Jan. 1950) pp. 139-155 (Jan. 1960).

Affiliated with

Also associated with

Rating

Distributed interconnect does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Distributed interconnect, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Distributed interconnect will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3770088