Distributed ground pads for shielding cross-overs of mutually ov

Wave transmission lines and networks – Plural channel systems

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333128, 333136, 333246, H01P 308, H01P 512

Patent

active

060972602

ABSTRACT:
A distributed ground pad-based isolation arrangement for a multilayer stripline architecture is configured to effectively inhibit the mutual coupling of signals between overlapping regions of adjacent stripline networks of dielectrically separated transmission networks, without substantially increasing either the mass of the laminate structure or the lossiness of the stripline. At regions of mutual overlap, the stripline layers are spatially oriented at right angles to one another, and a limited area ground pad is interleaved between the stripline layers. To maintain the desired characteristic line impedance of a stripline layer as it passes over a ground pad, the width of the stripline layer is reduced in the overlap region. Each ground pad is connected to an external ground reference by plated vias, that extend through the dielectric layers and intersect outer grounded shielding layers of the laminate.

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patent: 5153602 (1992-10-01), DuBois et al.
patent: 5296651 (1994-03-01), Gurrie et al.
patent: 5600285 (1997-02-01), Sachs et al.

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