Dissolved wafer fabrication process and associated microelectrom

Details Dissolved wafer fabrication process and associated microelectrom Dissolved wafer fabrication process and associated microelectrom

1998-06-08

2000-11-07

Niebling, John F.

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Mesa formation

438 40, 438 43, 438 48, 438 50, 438 51, 438 53, 438455, 438456, 438457, 438458, 438459, 438107, 438164, H01L 2100

Patent

active

06143583&

ABSTRACT:
The method of the present invention provides a process for manufacturing MEMS devices having more precisely defined mechanical and/or electromechanical members. The method of the present invention begins by providing a partially sacrificial substrate and a support substrate. In order to space the mechanical and/or electromechanical members of the resulting MEMS device above the support substrate, mesas are formed on the support substrate. By forming the mesas on the support substrate instead of the partially sacrificial substrate, the mechanical and/or electromechanical members can be more precisely formed from the partially sacrificial substrate since the inner surface of the partially sacrificial substrate is not etched and therefore remains planar. As such, trenches can be precisely etched through the planar inner surface of the partially sacrificial substrate to define mechanical and/or electromechanical members of the MEMS device. The present invention also provides an improved MEMS device, such as an improved gyroscope, that includes more precisely and reliably defined mechanical and/or electromechanical members.

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