Dissociated fabrication of packages and chips of integrated...

Details Dissociated fabrication of packages and chips of integrated... Dissociated fabrication of packages and chips of integrated...

2005-02-04

2008-12-02

Louie, Wai-Sing (Department: 2814)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Beam lead formation

C438S411000, C438S611000, C257S785000, C257SE23067

Reexamination Certificate

active

07459376

ABSTRACT:
A method of fabricating a semiconductor component includes providing a prefabricated frame that includes metal traces and lead-through contacts. A semiconductor chip is mounted into the prefabricated frame such that the semiconductor chip is embedded within a rim of the prefabricated frame. Contact regions on a surface of the semiconductor chip are electrically connected with the metal traces of the prefabricated frame such that the contact regions are electrically coupled to the lead-through contacts via the metal traces.

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