Dissipative ceramic bonding tool tip

Details Dissipative ceramic bonding tool tip Dissipative ceramic bonding tool tip

2005-08-30

2005-08-30

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S001100, C228S006100, C228S006200, C228S180500

Reexamination Certificate

active

06935548

ABSTRACT:
Methods for making and using dissipative ceramic bonding tool tips for wire bonding electrical connections to bonding pads on integrated circuit chips and packages. The method of using the dissipative ceramic bonding tool tip includes dissipating charge while bonding to avoid damaging delicate electronic devices by a sudden surge of accumulated charge. The method of making the tool tip includes affecting its conductivity so that it conducts electricity at a rate sufficient to prevent charge buildup, but not sufficient to overload the device being bonded. For best results, a resistance in the tip assembly itself should range from 5×104or 105to 1012ohms. In addition, the tips must also have specific mechanical properties to function satisfactorily.

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