Dissipation of heat through keyboard using a heat pipe

Details Dissipation of heat through keyboard using a heat pipe Dissipation of heat through keyboard using a heat pipe

1994-12-16

1996-04-30

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 802, 165 805, 165185, 174 152, 361687, 361704, 361720, H05K 720

Patent

active

055130704

ABSTRACT:
An improved heat dissipation device particularly suited for removing heat from a surface mounted integrated circuit component coupled to a printed circuit board in a portable computer. Vias, which are at least partially filled with a heat conductive material, improve heat transfer between a component and a heat conductive block mounted on opposite surfaces of the circuit board. A first section near one end of the heat pipe is attached to the heat conductive block in a channel formed receptive to the heat pipe. A second section of the heat pipe including the second end is attached to a metal plate which is affixed beneath the keyboard. Heat from the component flows through the vias to the block and is transferred by the heat pipe to the metal plate where it is dissipated.

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