Dissipating structure for central processing unit chip

Details Dissipating structure for central processing unit chip Dissipating structure for central processing unit chip

1992-11-05

1993-10-05

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

24625, 248510, 257718, 44516, H05K 720

Patent

active

052511014

ABSTRACT:
A dissipating structure for central processing unit chip includes a frame, a fixture, a felt board, a dissipating board, and a fan, wherein an open end of the fixture is rotatably secured to the frame. The rest edges of the fixture are formed like holding portion adapted to hold the chip, the felt board, and the dissipating board in place, sequentially. A plurality of dissipating elements are formed on the dissipating board adapted to dissipate heat created by cpu chip. Four dissipating blocks are formed at four corners of the dissipating board each having an aperture adapted to secure the fan thereon by means of screws.

REFERENCES:
patent: 4716494 (1987-12-01), Bright
patent: 5099550 (1992-03-01), Beane
patent: 5130888 (1992-07-01), Moore
patent: 5208731 (1993-05-01), Blomquist
"Spring Clip--Heat Sink", IBM Tech Discl. Bull. vol. 23 No. 12 May 1981, p. 5303, Almquist et al.

Affiliated with

Also associated with

Rating

Dissipating structure for central processing unit chip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dissipating structure for central processing unit chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dissipating structure for central processing unit chip will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1009301