Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-06-27
2006-06-27
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C257S716000, C165S080300
Reexamination Certificate
active
07068510
ABSTRACT:
A blade server module comprising: a housing assembly; a printed circuit board disposed within the housing assembly and mounted in a free-floating relationship thereto; a processor mounted on the printed circuit board; heat sink assembly disposed in the housing assembly in close proximity to the processor; and, one or more compliant compression elements disposed within the housing assembly so as to be preloaded to provide a force on the printed circuit board to force the heat source into thermal engagement with the heat sink assembly. Methods and systems are disclosed for effectively dissipating heat reliably in compact packaging arrangements that are particularly adapted for computing systems including blade servers.
REFERENCES:
patent: 5500556 (1996-03-01), Kosugi
patent: 5552961 (1996-09-01), Van Gaal et al.
patent: 5754401 (1998-05-01), Saneinejad et al.
patent: 5883782 (1999-03-01), Thurston et al.
patent: 5965937 (1999-10-01), Chiu et al.
patent: 5990549 (1999-11-01), Chiu et al.
patent: 6101094 (2000-08-01), Kermaani et al.
patent: 6361136 (2002-03-01), Watanabe et al.
patent: 6541855 (2003-04-01), Uzuka
patent: 6809930 (2004-10-01), Mueller et al.
patent: 6898081 (2005-05-01), Liu et al.
patent: 2003/0129863 (2003-07-01), Alcoe et al.
patent: 2004/0132331 (2004-07-01), Osborn et al.
patent: 2005/0088822 (2005-04-01), Oberlin et al.
patent: 2000196269 (2000-07-01), None
IBM Technical Disclosure Bulletin, vol. 7, No. 1, Jun. 1964, p. 113, “Heat Conducting Vibration and Shock Mount” by M. C. Panaro.
IBM Technical Disclosure Bulletin, vol. 24, No. 5, Oct. 1981, pp. 2534-2535, “Flip Chip Heat Sink” by A. H. Bauman and D. G. Peterson.
IBM Technical Disclosure Bulletin, vol. 29, No. 11, Apr. 1987, pp. 4950-4951, “Thermal Sponge” by S. K. Kang, P. G. Ledermann and P. A. Moskowitz.
Crippen Martin Joseph
Gallarelli Pat
Kreuz Benjamin Michael
Sinha Arvind Kumar
Datskovskiy Michael
International Business Machines - Corporation
Williams Robert R.
LandOfFree
Dissipating heat reliably in computer systems does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Dissipating heat reliably in computer systems, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dissipating heat reliably in computer systems will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3629337