Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-03-22
2010-10-19
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S710000, C361S719000, C165S080300, C257S712000, C313S046000
Reexamination Certificate
active
07817425
ABSTRACT:
A heat dissipating apparatus for an IC chip, having a structure capable of effectively dissipating heat created by an IC chip to the outside, and a display module including the same are disclosed. In one embodiment, the display module includes a panel that forms an image, a chassis disposed at the rear of the panel to support the panel, at least one IC chip that emits heat mounted on at least one circuit board installed at the rear of the chassis, and a heat dissipating apparatus that dissipates heat emitted by the IC chip to the outside. The heat dissipating apparatus is attached to contact the IC chip, and has a heat conducting chip contact plate, and a heat conducting heat discharging plate formed in one piece with a plurality of mutually proximal joining portions joined to the chip contact plate, and a plurality of heat dissipating portions bent to protrude outward from the joining portions to connect the joining portions.
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Gandhi Jayprakash N
Knobbe Martens Olson & Bear LLP
Samsung SDI & Co., Ltd.
Smith Courtney
LandOfFree
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