Disposable posts for self-aligned non-enclosed contacts

Fishing – trapping – and vermin destroying

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Details

457192, 457189, 457231, H01L 2128

Patent

active

056521820

ABSTRACT:
A disposable post process for contact openings to interconnect material of reduced geometry and no enlarged landing pads is disclosed. A layer of material is formed over interconnect regions on a semiconductor wafer and subsequently patterned into posts which define the location and shape of openings to be formed in a subsequently formed planar layer. After a layer is formed to surround the posts, the posts are removed to create openings in the layer above underlying interconnect regions. These openings may then be used to form suitable contacts to the interconnect regions.

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patent: 5084413 (1992-01-01), Fujita et al.
patent: 5183782 (1993-02-01), Onishi et al.
patent: 5514622 (1996-05-01), Bornstein et al.
patent: 5518963 (1996-05-01), Park

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