Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-03-28
2006-03-28
Blum, David S. (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S258000
Reexamination Certificate
active
07018868
ABSTRACT:
The invention is a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes buried bitlines in a semiconductor substrate. Additionally, doped regions are formed adjacent the buried bitlines. The doped regions adjacent the buried bitlines inhibit a leakage current between the buried bitlines.
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Claims from U.S. Appl. No. 10/770,673, filed Feb. 2, 2004.
Erhardt Jeff P.
Kamal Tazrien
Park Jae-yong
Qian Weidong
Ramsbey Mark T.
Advanced Micro Devices , Inc.
Blum David S.
Renner , Otto, Boisselle & Sklar, LLP
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