Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-03-24
2002-08-20
Martin, David (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S777000, C361S793000, C340S572500, C340S572800, C340S572700, C257S679000, C257S647000
Reexamination Certificate
active
06437985
ABSTRACT:
This disclosure is based upon, and claims priority from, French Patent Application Nos. 97/12444 and 97/14582, filed Sep. 26, 1997 and Nov. 14, 1997, respectively, the contents of which are incorporated herein by reference.
FIELD OF THE INVENTION
The present invention concerns the field of electronic chip devices comprising a communication interface, and their manufacturing process. It concerns in particular chip devices, the interface of which is by contact and/or antenna, such as chip card or label micromodule. It relates particularly to antenna devices which are disposable or used only once which can communicate over distances of more than 50 cm, especially at frequencies of several mega-herz to several giga-hertz.
BACKGROUND OF THE INVENTION
International Patent Application WO 97/26621 describes a chip and antenna module which can be scanned as a label. Cards are produced by inserting the antenna module in a cavity of a card body and certain labels are produced by packaging the antenna module in some kind of support such as a tally, for example.
These modules comprise an interface support film, commonly called a printed circuit, which contains at least one interface under the form of an antenna and/or under the form of connection pads, a microcircuit such as a chip connected to the interface and an encapsulating material to protect the microcircuit and its connections. The antenna is placed on one face of the micromodule especially on the reverse side of the latter, while the other face can possibly be equipped with connection pads.
The interface support film should possess certain mechanical properties due especially to the requirements of modern production processes. In particular, it is so flexible that it can be rolled up on reels but equally rigid so that it can be transported by sprockets engaging the side perforations. The rigidity of the interface support film is also such that it will break if folded.
The support films presently in use are selected from among epoxy glass, polyimide, and polyethylene terephtalate (PET). They have the following typical properties and characteristics: a thickness of between 75 &mgr;m and 125 &mgr;m, elongation at break of less than 75%, temperature resistance up to at least 160° C.
The interface itself is generally copper; it presents a hard surface, the tracks are in general narrow (50 to 200 &mgr;m) and have precise definition in the order of a few microns. The interface in general undergoes surface treatment for example of the Ni—Au type which makes it even harder, easier to weld and protects it from oxidation.
The devices produced according to the above requirements have the disadvantage of being too bulky for the use envisaged in the invention. In addition, they have limited applications which do not correspond to the aims of the invention listed below.
The main object of the invention is to design an electronic chip device with or without contact, powered or otherwise, which is very economic and nevertheless very reliable, and is compatible with a manufacturing process comprising the least number of operations and using the most economic standard techniques possible in such a way as to promote its use and make it disposable if required.
Another object is to design a device of the above type which can also communicate preferably beyond 50 cm (non-powered) and beyond a meter (powered).
Another object is to design and economically manufacture an antenna and/or contact module which can easily and directly be printed especially by the user.
Another object is to design a device of the above type which can be used with all reliability in a variety of conditions and on multiple supports.
Another object is to design and economically manufacture chip cards or tickets with or without contact.
SUMMARY OF THE INVENTION
Some of these objects are achieved by using an interface support film having properties totally distinct and opposite to those required for interface support films in the field of the chip cards presented above, but also by adopting a manufacturing process in a roll, then by adapting this process, especially in regard to the connection of the chip, to take into account the new properties of the film. Other objects are achieved by specific configuration of the device described below.
For this purpose the invention firstly is intended as an electronic chip device, comprising an interface support film having a support film and at least one flat conductive interface placed on the support film as well as a microcircuit connected to the interface. It is distinguished in that the interface support film possesses such properties that it can be creased or folded on itself without deterioration.
Good results have been obtained with a support film and an interface which can be creased or folded together according to a curve radius of less than 2.5 mm and preferably less than 1 mm.
This definition corresponds to the choice of a support film, the properties of which are intrinsically downgraded in comparison to state of the art support films and/or the reduced thickness combined with an interface, the intrinsic properties of which are equally downgraded in comparison to state of the art interfaces or those of reduced thickness. According to the invention, the properties of each (support film and/or interface (s)) should be considered in combination. They can in particular be enormously downgraded for both, or those of one very much downgraded and those of the other less so; the thickness of each can also be reduced to a greater or lesser extent according to the degree of downgrading of the support film and interface materials.
Due to such an association and combination, a reliable, low-cost device is provided in spite of the handling which it can be made to undergo.
It is to be noted that in certain cases the downgrading, for example in regard to rigidity, can be accompanied by other qualities in the final product, for example in regard to elasticity but which cause manufacturing difficulties. The downgrading should be understood in the context of the invention in relation to the properties presently sought in the field of chip cards.
According to one characteristic, the support film possesses a thickness of less than 75 &mgr;m, the best results being obtained with a thickness of between 10 &mgr;m and 30 &mgr;m.
With such a thin support film the invention provides not only a saving in material with a potential bearing on the price and especially a saving in the weight of the final device, thus providing new opportunities of application described below.
According to other characteristics of the invention the support film can be preferably a polymer with an elongation at break of more than 80%, and/or Shore hardness of less than 80 and/or a vitreous transition temperature Tg of less than 0° C. and/or a fusion temperature of less than 130° C.
Preferably the support film is selected from among polypropylene (PP), polyethylene (PE), polyethylene teraphtalate (PET). In other cases it can contain fibrous material, for example cellulose or textile.
The metal of the interface is preferably natural with no surface treatment aimed at hardening it, for example the Ni—Au type. Preferably it is less than 50 &mgr;m in thickness. Aluminum and its alloys are the preferred metal.
Materials such as PE, PP and PET are very economically advantageous since they are produced in very long and wide rolls in a field distinct from chipcards, such as packaging. The PE/aluminum or PP/aluminum combinations the use of which the invention proposes as a base to create an interface support film, are equally very common, especially in the field of food packaging (for yogurt lids, champagne corks, etc.)
According to another characteristic, the device comprises a microcircuit preferably situated outside the turns, especially in a corner of the support film. Preferably again the microcircuit is placed directly on the support film.
Preferably the device also comprises an interface element known as “strap” on the other face to pull back at least one end of the antenna in the v
Blanc Rene-Paul
Desoutter Isabelle
Garnier Pierre
Martin Philippe
Bui Hung
Gemplus
Martin David
LandOfFree
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