Electric lamp and discharge devices – With luminescent solid or liquid material – Solid-state type
Patent
1974-12-23
1976-02-03
Kominski, John
Electric lamp and discharge devices
With luminescent solid or liquid material
Solid-state type
29589, 357 17, H01I 1500
Patent
active
039366944
ABSTRACT:
A display structure comprising a substrate of transparent dielectric material, a first layer of copper on one major surface of the substrate etched to provide a plurality of conductive paths leading to a plurality of light emitting diodes disposed on the substrate in a display configuration, the junction plane of each diode being disposed perpendicular to the substrate. The spacing between two conductive paths which provide a potential difference across the diode at the point where the diode is located being slightly greater than the distance between the two electrodes of the diode. A solder paste mechanically secures the diode in place and electrically connects the electrodes of the diode to their associated conductive paths. A second layer of copper is formed on the other major surface of the substrate is etched to provide openings therethrough to said substrate below the location of each diode. These openings are slightly wider than the spacing between the two conductive paths to which the diode is connected. The second layer of copper is preferably blackened, such as by applying a so-called black-nickel plating consisting of alloy plating of zinc, sulpher and nickel.
In a second form of the invention, a nickel layer covers the first copper layer. The conductive paths are then formed in the first copper layer by etching out both the nickel layer and the first copper layer. A further etching under-etches the nickel layer to form overhanging eaves. The eaves facing each diode are bent down when the diode is forced into the etched opening which provides both mechanical support as well as an electrical connection with their associated conductive paths. Preferably, the nickel layer and first copper layer are coated where exposed with tin.
A solder paste may alternatively be used with the down bent eaves of the nickel layer to electrically connect the nickel layer to the electrically conductive paths.
A fourth form of the invention employs an iron plate in place of the first copper layer and copper in place of nickel for the layer providing the overhanging eaves. An etched copper layer extends down from the iron layer into the substrate. A black ceramic layer underlies the transparent substrate. The diodes in this case are viewed from above rather than from below as in the other three embodiments.
REFERENCES:
patent: 3368276 (1968-02-01), Renskers
patent: 3573568 (1971-04-01), Siegel
patent: 3886581 (1973-05-01), Katsumura et al.
Kominski John
Sony Corporation
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