Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Making emissive array
Reexamination Certificate
2010-08-13
2011-11-22
Toledo, Fernando L (Department: 2895)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Making emissive array
C257S762000, C257SE29147
Reexamination Certificate
active
08062917
ABSTRACT:
A display panel structure having a circuit element disposed thereon and method of manufacture are provided. The display panel includes a substrate and the circuit element disposed on the substrate. The circuit element has a first interface layer and a first conductive layer. Both the first interface layer and the first conductive layer have cooper materials. The material which makes the first interface layer includes a reactant or a compound of the material which makes the first conductive layer. The method for manufacturing includes the following steps: forming a first interface layer on the substrate; forming a first conductive layer on the first interface layer; and etching the first conductive and interface layers to form a pattern. The existence of the first interface reduces the penetration of the first conductive layer on the substrate and improves the adhesive force between the first conductive layer and the substrate.
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Chinese language Office Action dated Nov. 30, 2007.
English language translation of abstract, relevant parts of specification, and figures for JP 2005-166757.
Lin Chun-Nan
Tsai Wen-Ching
Tu Kuo-Yuan
Wu Shu-Feng
AU Optronics Corporation
Thomas Kayden Horstemeyer & Risley LLP
Toledo Fernando L
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