Display device and manufacturing method of the same

Details Display device and manufacturing method of the same Display device and manufacturing method of the same

2006-11-28

2006-11-28

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C349S151000, C257SE23021, C257S786000

Reexamination Certificate

active

07141877

ABSTRACT:
The present invention enhances the mounting accuracy of a drive circuit chip on a substrate thus realizing a display of high quality. Bumps (for example, gold bumps) on the drive circuit chip are used for alignment. Here, to enhance the recognition property of the alignment bumps, a plane shape of a conductive layer which is formed between a semiconductor substrate (Si substrate) of the drive circuit chip and the alignment bump is set to be included within a profile of a plane shape of the alignment bump. That is, by preventing the conductive layer from being observed in a periphery of the alignment bump, it is possible to prevent a photographed pattern of the bump taken by a camera or the like from be influenced by the conductive layer.

REFERENCES:
patent: 5739887 (1998-04-01), Ueda et al.
patent: 2004/0009303 (2004-01-01), Ito et al.

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