Display device and manufacturing method of the same

Details Display device and manufacturing method of the same Display device and manufacturing method of the same

2011-05-24

2011-05-24

Jackson, Jr., Jerome (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S797000, C257SE23020, C257SE23021, C257SE23179, C349S151000, C349S152000

Reexamination Certificate

active

07948080

ABSTRACT:
A display device includes a drive circuit chip, and a substrate on which the drive circuit chip is mounted. The drive circuit chip includes a semiconductor substrate, an insulation layer, a first conductive layer and a second conductive layer formed of metal between the semiconductor substrate and the insulation layer, and a first bump and a second bump formed over the insulation layer. The first bump is superposed with the first conductive layer, and a profile of the first bump in plan view is within a profile of the first conductive layer in plan view. The second bump is superposed with the second conductive layer, and a profile of the second pump in plan view is beyond a profile of the second conductive layer in plan view.

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