Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1982-11-12
1984-10-02
Ramsey, Kenneth J.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228180R, B23K 106
Patent
active
044743220
ABSTRACT:
A displacement soldering device comprising a container for molten solder, a support structure for supporting a printed circuit board (PCB) over the surface of solder in the container, means for displacing the surface using a partial vacuum, when molten, vertically relative to the container and support structure into contact with a PCB when supported thereby to effect a soldering operation thereon.
REFERENCES:
patent: 2771049 (1956-11-01), Fish
patent: 4047655 (1977-09-01), McCafferty
patent: 4203531 (1980-05-01), Reichel et al.
EPE Corporation
Jordan M.
Ramsey Kenneth J.
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