Displacement soldering device

Details Displacement soldering device Displacement soldering device

1982-11-12

1984-07-31

Godici, Nicholas P.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

B23K 108

Patent

active

044625324

ABSTRACT:
A displacement soldering device having first and second ends to support, a PCB over the surface of molten solder in a container, and a support structure handling mechanism having, a first member to which said first end is pivotally attached, a latch, to which said second end is pivotally attached, moveable between latched and unlatched operational positions, said latch in its latched position being pivotally supported on said member and in its unlatched position permitting said support structure to pivot downwardly about said first end, means for lateral displacement of said support structure between a soldering position and a PCB access position, means for unlatching said latch when said solder is displaced into contact with a PCB supported by said support structure, means for latching said latch subsequent to a soldering operation, and means for elevating said support structure during said lateral displacement from said soldering position and for lowering said support structure during said lateral displacement to said soldering position.

REFERENCES:
patent: 3056372 (1962-10-01), Bassett et al.
patent: 3532262 (1970-10-01), Laubmeyer et al.
patent: 3606132 (1971-09-01), Rinaldi et al.
patent: 3828419 (1974-08-01), Wanner

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