Dispersion strengthened lead-tin alloy solder

Stock material or miscellaneous articles – All metal or with adjacent metals – Laterally noncoextensive components

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Details

428643, 420558, 420570, C22C 1300, C22C 1106

Patent

active

050665448

ABSTRACT:
An improved dispersion strengthened lead-tin alloy solder is provided in which there is dispersed in the solder up to about 5 vol. percent of small particles, of a metal sulfide or a nickel-tin intermetallic.

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P. B. Kadam et al., "High Temperature Creep Behaviour of Lead-base Particulate Composites", J. of Materials Science 18 (1983) 140-144.

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