Dispersion strengthened copper alloy and a method of manufacturi

Details Dispersion strengthened copper alloy and a method of manufacturi Dispersion strengthened copper alloy and a method of manufacturi

1989-10-10

1991-04-02

Lechert, Jr., Stephen J.

Specialized metallurgical processes, compositions for use therei

Compositions

Consolidated metal powder compositions

75234, 75235, 75236, 75238, 75241, 75244, 419 12, 419 13, 419 14, 419 15, 419 16, 419 17, 419 19, 419 23, 428552, C22C 2912

Patent

active

050044982

ABSTRACT:
A dispersion strengthened copper alloy containing a copper matrix, and dispersion particles dispersed in the copper matrix within a range of 0.5 to 6 vol %. In this alloy, an average diameter of a matrix region where the dispersion particles are not present is 0.3 .mu.m or less, and the total amount of solid solution elements contained in the copper matrix is determined such that, when this amount of the solid solution elements is added to pure copper, the electric conductivity of the matrix is lowered by 5% IACS or less.

REFERENCES:
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patent: 3779714 (1973-12-01), Nadkarni et al.
patent: 3922180 (1975-11-01), Fuchs et al.
Transactions of the Metallurgical Society of AIME, vol. 221, Apr. 1961, "Dispersion Strengthening in the Copper-Alumina System", pp. 371-377.
Chemical Abstracts, vol. 89, No. 20, 13th Nov. 1978, p. 263, Col. 1, Abstract No. 167715m, Columbus, Ohio, US; G. Yamauchi et al.: "On the Spacing Parameters of Dispersion Alloys", & Trans. Jpn. Soc. Compos. Mater., 1977, 3(1-2), 45-52.

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