Dispersion plating method

Details Dispersion plating method Dispersion plating method

1991-12-17

1993-03-23

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating contains embedded solid material

C25D 1500

Patent

active

051961075

ABSTRACT:
A dispersion plating method in which plating is conducted while plating liquid containing both abrasive grains of a size larger than 10 .mu.m and another grains is brought into contact with the surface of an object to be plated, the latter grains then being removed by washing with water with only abrasive grains being entrapped in a metal matrix. Plating liquid is circulated through a filter of a filtering size smaller than the average grain size of abrasive grains and the abrasive grains are made into a flocculating condition and adhered to the surface of object to be plated. Furthermore, abrasive grains are adhered to the surface of object to be plated in a plating thickness of less than one half of average grain size of abrasive grains.

REFERENCES:
H. Enomoto, "Compisite Plating", published by Nikkan Kogyo on Aug. 30, 1989, p. 108.
"Metal Surface Technique", published by Metal Surface Technique Association in 1982, vol. 33, No. 6, p. 285.
"Manufacturing Method of Electro Plated Tool and Efficiency Thereof", presented in the technical symposium, Partner for Improving Productivity-Diamond.

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