Dispersion for chemical mechanical polishing

Details Dispersion for chemical mechanical polishing Dispersion for chemical mechanical polishing

2005-06-14

2005-06-14

Goudreau, George A. (Department: 1763)

Compositions

Etching or brightening compositions

C252S079200, C252S079300, C252S079400

Reexamination Certificate

active

06905632

ABSTRACT:
An aqueous dispersion is used in the chemical mechanical polishing of surfaces, particularly oxidic surfaces, such as silicon dioxide. The aqueous dispersion contains a powder of pyrogenically produced silicon dioxide doped with 0.01 and 3 wt. % aluminium oxide, relative to the total amount of powder, said powder having an average particle diameter in the dispersion of not more than 0.1 μm.

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