Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Patent
1992-11-17
1994-12-06
Marquis, Melvyn I.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
523418, C08K 320, C08L 6302
Patent
active
053711181
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
This invention relates to two-component film-forming reactive systems for the surface bonding and/or coating of substrates, more particularly for heat-sealable coatings, based on aqueous dispersions of relates to a process for the production of composites and adhesive-coated substrates.
BACKGROUND OF THE INVENTION
Special adhesive systems are required for the production of laminates and composites, but especially for the production of base materials for flexible printed circuits. Systems such as these have to meet very stringent requirements because, on the one hand, materials that are difficult to bond, such as copper foils for example, have to be bonded to polyimide films and, on the other hand, the composites have to be flexible and also highly heat-resistant. Solvent-containing adhesive systems based on modified polyurethane, polyester, acrylate and epoxy resins are known to the expert for such purposes. In addition to the basic solvent problem, systems of the type in question are often attended by the disadvantage that the cure times are far too long, for example up to 14 days in the case of polyurethane adhesive systems, or the curing temperatures are too high, for example up to 240.degree. C. in the case of epoxy resin or acrylate systems. Water-based systems have been developed with a view to eliminating the solvent problem. Thus, JP 87/153371 and JP 85/118781 describe water-based adhesives for flexible printed circuits which contain dispersions of acrylate (co)polymers and epoxide compounds. A major disadvantage of systems such as these are their relatively long cure times, for example 16 hours at 130.degree. C. in the case of JP 87/153371. JP 87/112676 describes waterborne polyurethane adhesives based on polyurethane dispersions (A) obtained from polytetramethylene glycol (MW 400 to 2000), an organic diisocyanate and a dimethylol carboxylic acid and also hydrazine or dihydrazides as chain-extending agents neutralized with tertiary amines and a water-soluble compound (B) containing 2 or more epoxide or aziridine rings per molecule. Although it is mentioned as an example that various films, for example PET and polypropylene, can be bonded to one another with this adhesive, there is no suggestion that adhesives of the type in question could be suitable for heat-sealable coatings. In addition, there are no references to the production of non-blocking coatings or to the special use for the production of flexible printed circuits.
Accordingly, the problem addressed by the present invention was to provide water-based reactive systems which would be capable of achieving high bond strengths, even in the case of difficult substrates, such as polyimides. In addition, the invention set out to guarantee high flexibility, high insulation resistance, high heat resistance and high solder bath resistance. The cure time would be relatively short and the curing temperature below 200.degree. C. In addition, the particular need for blocking resistance would be satisfied. By blocking resistance is meant the non-tackiness of a film--which has been produced by coating of a substrate with the reactive system according to the invention and subsequent drying--at typical room and storage temperatures. In addition, the invention would provide a new raw material base or a different class of polymers as starting material for such systems.
BRIEF SUMMARY OF THE INVENTION
According to the invention, this problem has been solved by two-component film-forming reactive systems for the surface-to-surface bonding and/or coating of substrates, more particularly for heat-sealable coatings, based on aqueous dispersions of at least one resin (I) curable with epoxides and epoxide compounds as curing agents (Ill), characterized in that polyurethane polymers containing functional groups reactive to epoxides and, if desired, other resins are present as the curable resin (Ia).
Accordingly, the two-component reactive system according to the invention contains dispersions of a resin (I) curable with epoxides and dis
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Chemical Abstract, JP 87/153371, 1988.
Chemical Abstract, JP 85/118781, 1986.
Ullmann, Eczyklopaedie der technischen Chemie, vol. 10, 1974, pp. 563-580 (1973).
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Encyclopedia of Polymer Science and Engineering, vol. 6, 1986, pp. 1-51.
Bolte Gerd
Brueninghaus Ulrike
Henke Guenther
Aylward D.
Henkel Kommanditgesellschaft auf Aktien
Jaeschke Wayne C.
Marquis Melvyn I.
Ortiz Daniel S.
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