Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate
2005-03-15
2005-03-15
Talbot, Brian K (Department: 1762)
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
C427S256000, C427S098400, C222S319000, C222S464100, C222S566000
Reexamination Certificate
active
06866881
ABSTRACT:
A dispensing system and method for dispensing material onto a substrate. The dispensing system includes a frame, a support, coupled to the frame, that supports the substrate at a dispensing position in the dispensing system, and a dispensing head, coupled to the frame, that dispenses the material onto the substrate. The dispensing head includes a motor unit having a first motor coupled to an output drive mechanism, and a dispensing unit, removably coupled to the motor unit, having a material outlet from which the dispensing material is dispensed, the dispensing unit having a dispensing mechanism coupled to the material outlet and coupled to the output drive mechanism of the motor unit such that operation of the first motor causes the dispensing mechanism to dispense material through the outlet. The dispensing head may be controlled for deposition of dots of material having diameters smaller than a dispensing needle of the dispensing unit.
REFERENCES:
patent: 4762578 (1988-08-01), Burgin, Jr. et al.
patent: 4807794 (1989-02-01), Hess
patent: 5819983 (1998-10-01), White et al.
patent: 5837892 (1998-11-01), Cavallaro et al.
patent: 6551557 (2003-04-01), Rose et al.
patent: 6722395 (2004-04-01), Overbeck et al.
patent: 0278457 (1988-08-01), None
patent: WO 8603367 (1986-06-01), None
patent: WO 9519099 (1995-07-01), None
Timms, “Practical Tips for Adhesives Evaluation”, SMT's Solutions for Today, HIS Publishing Group, Jul. 1997.
“Dispensing Solutions From GPD”, SMT's Free Literature, Circle 13, May 1995, vol. 9. No. 5.
“Why Buy Your Dispenser From Another Company?”, SMT, Apr. 1994, vol. 8, No. 4.
Valerie, V.P., “The Case for Gantry Robots in Machine Loading”, Robotics Today, Aug. 1984.
“High-Speed & High-Precision”, Information on Surface Mount Technology, Siemens, Siplace News, Aug. 1995.
“Traum Order Wirklichkeit Dream or Reality, Information on Surface Mount Technology”, Siemens, Siplace News, Feb. 1996.
Electronic Packaging & Production, The New Standard SIPLACE, Siemens, A Cahners Publication, Jan. 1997.
“A New Concept in High-Volume SMT”, Electronic Production, SMT, Circle 28, Mar. 1994, vol. 23, No. 3.
New Products, Electronic Production, SMT, May 1996, vol. 25, No. 5.
“SIPLACE 80 S-20: The Placement System with two Revolver Heads for High-End Speed”, Siemens.
“SIPLACE 80-S15: The High-Speed SMD Placement System with 2 Revolver Heads”, Siemens.
“SIPLACE G: For the Rapid and Reproducible Application of Adhesive”, Siemens.
“Surface Mount Assembly Equipment—On top of your Needs”, Philips Electronic Manufacturing Technology.
“Fast Component Mounter—FCM Dual-Lane Transport Handles Both Sides of a PCB In One Pass”, Philips Electronic Manufacturing Technology.
Crouch Kenneth C.
Ke Yingfei
Prentice Thomas C.
Prescott Brian P.
Scott Murray D.
Lowrie Lando & Anastasi, LLP
Speedline Technologies, Inc.
Talbot Brian K
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