Dispensing apparatus and method

Details Dispensing apparatus and method Dispensing apparatus and method

2000-05-26

2003-04-15

Walsh, Donald P. (Department: 3658)

Article dispensing

With dispensing-type outlet

With closure for outlet

C221S195000, C221S197000, C221S276000, C221S265000, C221S224000, C221S278000, C228S041000, C228S245000, C228S244000, C228S246000, C406S064000

Reexamination Certificate

active

06547097

ABSTRACT:

BACKGROUND OF THE INVENTION
This application relates to dispensing.
Many applications call for an automatic mechanism that dispenses a desired amount of a material. For example, in an automatic assembly line used in producing semiconductor-based electronic circuits, when an electronic part such as a chip resistor, a capacitor, or a packaged integrated circuit (“IC”) is to be mounted onto a substrate having a circuit pattern formed thereon, creamy solder is deposited in a selected position on the substrate by use of a dispenser and then the electronic part is automatically mounted in the selected position by use of a chip mounter.
Other applications use solder spheres, also known as solder balls, instead of creamy solder or as electrical connection points known as leads. For example, high density I/O chip carriers use ball grid array packages (“BGAs”) that have a high I/O count at a relatively coarse pitch. Typically, the solder balls are dispensed in a predetermined pattern on or in an electronic part or circuit. In some cases, the electronic part or circuit can be rendered inoperative even if only a single solder ball is missing from the pattern after an attempt has been made to dispense solder balls in the pattern on the part or circuit. In such a case, the only means (or the only cost effective means) available for dispensing the solder balls may be a device, such as a stencil having apertures as disclosed in U.S. Pat. No. 5,431,332 which is incorporated by reference, that is provided for dispensing a large amount of solder balls at once on a clean substrate, i.e., a substrate having no solder balls. If so, it may be impossible or impractical to use the available device to dispense a single solder ball, and therefore it may be necessary to discard the part that is missing the single solder ball.
SUMMARY OF THE INVENTION
Apparatus and a method are provided for dispensing. In particular, dispensing apparatus is provided for dispensing items. The dispensing apparatus includes a dispensing outlet and an item holder having item holding areas and being movably disposed to position the item holding areas one at a time in sequence over the dispensing outlet so that when one of the item holding areas is positioned over the dispensing outlet, the other item holding areas are not disposed over the dispensing outlet. The dispensing apparatus further includes a blocker disposed over the item holder opposite the dispensing outlet, the blocker blocking access to the dispensing outlet from directly above the item holder when the item holder positions one of the item holding areas over the dispensing outlet. The apparatus and method allow the dispensing of items to be controlled so that only one of the items is dispensed at a time. An item such as a solder ball can be dispensed at a selected destination by positioning the dispensing outlet appropriately with respect to the selected destination (e.g., above a selected circuit board location) and then rotating the item holder to bring the item to the dispensing outlet.
Other features and advantages will become apparent from the following description, including the drawings, and from the claims.


REFERENCES:
patent: 3572703 (1971-03-01), Greene
patent: 3616967 (1971-11-01), Mueller
patent: 3785525 (1974-01-01), Handeland
patent: 3788518 (1974-01-01), Beebe
patent: 3883040 (1975-05-01), Bell
patent: 3921851 (1975-11-01), Nilson
patent: 4033031 (1977-07-01), Ballew
patent: 4278184 (1981-07-01), Willis
patent: 4324347 (1982-04-01), Thomas
patent: 4560100 (1985-12-01), Hall
patent: 4653665 (1987-03-01), Heisner et al.
patent: 4667959 (1987-05-01), Pfeiffer et al.
patent: 4674651 (1987-06-01), Scidmore et al.
patent: 4838453 (1989-06-01), Suckstead
patent: 5042686 (1991-08-01), Stucki
patent: 5159581 (1992-10-01), Agans
patent: 5205896 (1993-04-01), Brown et al.
patent: 5279045 (1994-01-01), Odashima et al.
patent: 5480062 (1996-01-01), Rogers et al.
patent: 5582493 (1996-12-01), Hineno et al.
patent: 5609268 (1997-03-01), Shaw
patent: 5649356 (1997-07-01), Gieskes
patent: 5655704 (1997-08-01), Sakemi et al.
patent: 5725124 (1998-03-01), Bustos et al.
patent: 5803309 (1998-09-01), Yuyama et al.
patent: 5852911 (1998-12-01), Yuyama et al.
patent: 5927546 (1999-07-01), Yuyama et al.
patent: 6056190 (2000-05-01), Foulke et al.
patent: 6073817 (2000-06-01), Jairazbhoy
patent: 6088911 (2000-07-01), Isogai et al.
patent: 6170226 (2001-01-01), Chang
patent: 6189676 (2001-02-01), Ansaloni
patent: 6202918 (2001-03-01), Hertz
patent: 6208911 (2001-03-01), Yamaoka et al.
patent: 6227437 (2001-05-01), Razon et al.
patent: 6234343 (2001-05-01), Papp
patent: 6253992 (2001-07-01), Fjelstad
patent: 9-323701 (1997-12-01), None
patent: 10-192367 (1998-07-01), None

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