Dispenser for supplying small amounts of a pasty substance for s

Dispensing – Processes of dispensing

Patent

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Details

2221461, 222309, 222504, 222518, 222559, G01F 1100

Patent

active

052054390

ABSTRACT:
The dispenser is used for supplying small amounts of a pasty substance, e.g. solder paste, onto printed circuit boards for the surface mounting of electronic components. It has a generally tube-like housing (20) forming at its lower end a nozzle (54) and a valve face (32). A nozzle element (28) is slidably arranged in the housing (20), has a valve needle (30) cooperating with the valve face (32), and furtheron is biased in closed position of the valve needle (30) at the valve face (32) by a spring (44) and connected with a plunger (40) arranged in a cylindrical part of the housing (20). The housing (20) is surrounded by a tube-like shell (56) in such a distance, that a toroidal chamber (58) between housing (20) and shell (56) is formed. During use cooling or heating gas flows through this toroidal chamber (58), the toroidal chamber (58) furtheron having an upper connector (62) for a duct (64) supplying the gas and a lower outlet (70) for free outflow of the gas.

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