Dispensed electrical interconnections

Details Dispensed electrical interconnections Dispensed electrical interconnections

2006-01-19

2008-10-28

Geyer, Scott B (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C257SE21499

Reexamination Certificate

active

07442564

ABSTRACT:
An electronic device includes a substrate, an electrical element on the substrate, a nonconductive adhesive material on the substrate, and a conductive adhesive material on the electrical element and extending onto the nonconductive adhesive material. Methods of forming a packaged LED include providing a substrate having an electrical element thereon, and dispensing a nonconductive adhesive material on the substrate. The nonconductive adhesive material is at least partially cured, and a conductive adhesive material is dispensed on the electrical element and on the at least partially cured nonconductive material. The conductive adhesive material is at least partially cured. The conductive adhesive material may provide an electrical connection between the electrical element and a second electrical element on the substrate or on another substrate.

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