Disordered coating with cubic boron nitride dispersed therein

Details Disordered coating with cubic boron nitride dispersed therein Disordered coating with cubic boron nitride dispersed therein

1995-11-09

1999-07-27

Turner, Archene

Stock material or miscellaneous articles

Structurally defined web or sheet

Including components having same physical characteristic in...

428336, 428698, 428704, 51307, 51309, C23C 1406

Patent

active

059287713

ABSTRACT:
A coating of cubic boron nitride dispersed in a matrix of disordered boron and carbon, such as boron carbide, is provided by sputtering. The coating is wear resistant, adherent, lubricous, and suitable as a coating for tools, molds, and wear parts. The coating has first, second, and third regions. The first region is sputtered in an inert atmosphere onto a substrate such as tool steel and is at least one layer of disordered boron and carbon. The inert sputtering atmosphere is gradually replaced with nitrogen to form the second region, which has cubic boron nitride crystals in a gradually increasing concentration dispersed in a matrix of disordered boron and carbon. The third region atop the second region is an outer wear layer that has a substantially uniform concentration throughout of cubic boron nitride dispersed in disordered boron and carbon.

REFERENCES:
patent: 4384933 (1983-05-01), Takasaki
patent: 4619865 (1986-10-01), Keem et al.
patent: 4716083 (1987-12-01), Eichen et al.
patent: 4735856 (1988-04-01), Schultz et al.
patent: 5057199 (1991-10-01), Lievens et al.
patent: 5075130 (1991-12-01), Reeber et al.
patent: 5270263 (1993-12-01), Kim et al.
patent: 5346601 (1994-09-01), Barada et al.
patent: 5478634 (1995-12-01), Setoyama et al.
patent: 5503912 (1996-04-01), Setoyama et al.
patent: 5670252 (1997-09-01), Makowiecki et al.
R.F. Bunshah, "PVD and CVD Coatings," ASM Handbook.RTM. Friction, Lubrication, and Wear Technology, vol. 18, pp. 840-849 (1992).
R.A. Swady et al., "The reactive sputtering of thin films of TiN at low target voltages," Vacuum, vol. 44, No. 3/4, pp. 297-301 (1993).
A. Leyland et al., "Plasma Nitriding in a Low Pressure Triode Discharge to Provede Improvements in Adhesion and Load Support for Wear Resistant Coatings," Surface Engineering, vol. 7, No. 3, pp. 207-215 (1991).
J.I. Onate et al., "Deposition of hydrogenated B-C thin films and their mechanical and chemical characterization," Surface and Coatings Technology, 49, pp. 548-553 (1991).
M.G. Fleming et al., "A Comparison of Magnetron Sputtered and Arc Evaporated PVD Thin Films for Wear Applications in Multipoint Cutting Tools," Journal of Materials Processing Technology, 32, pp. 481-488 (1992).
P.V. Kola et al., "Magnetron sputtered carbon nitride films," Surface and Coatings Technology, 68/69, pp. 188-193 (1994).
Gunter Spur et al., "The Performance of High Speed Steel Indexible Inserts Coated By Physical Vapour Deposition in the Milling of Ductile Materials," Surface and Coatings Technology, 43/44, pp. 1074-1085 (1990).
E.K. Gol'man et al., "Determination of the optimum discharge parameters in reactive magnetron sputtering of NbN films," Sov. Tech. Phys. Lett., 18(9), p. 584 (Sep. 1992).
Ralf Riedel, "Materials Harder Than Diamond?," Adv. Mater., 4, No. 11, pp. 759-761 (1992).
Patent Abstracts of Japan, vol. 013, No. 590 (P-984), Dec. 26, 1989 and JP, A, 01 251313 (Fuji Electric Co Ltd), Oct. 6, 1989.
H. Lithje et al., "Preparation of Cubic Boron Nitride Films by Use of Electrically Conductive Boron Carbide Targets," Thin Solid Films, vol. 257, No. 1, pp. 40-45, Feb. 15, 1995.

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