Plastic article or earthenware shaping or treating: apparatus – Female mold and charger to supply fluent stock under... – With preform severing means movable relative to mold
Reexamination Certificate
2007-06-12
2007-06-12
Heckenberg, Donald (Department: 1722)
Plastic article or earthenware shaping or treating: apparatus
Female mold and charger to supply fluent stock under...
With preform severing means movable relative to mold
C425S308000, C425S810000
Reexamination Certificate
active
10706934
ABSTRACT:
It is possible to obtain a disk substrate in which an edge of a center hole is free of flash. The disk substrate (23) in which the center hole (24) is provided with a straight portion (24a) and a tapered portion (24b), and an edge on the side of a signal transfer surface (22) of the tapered portion (24b) is provided with an R surface or C surface (24c), a mold apparatus optimum for molding the disk substrate (23), and a disk taking-out apparatus.
REFERENCES:
patent: 5340303 (1994-08-01), Maus et al.
patent: 5427520 (1995-06-01), Shimizu et al.
patent: 5552098 (1996-09-01), Kudo et al.
patent: 2001/0026817 (2001-10-01), Shida et al.
patent: 63-147619 (1988-06-01), None
patent: 63-206925 (1988-08-01), None
patent: 3-76615 (1991-04-01), None
patent: 3-79322 (1991-04-01), None
patent: 4-195743 (1992-07-01), None
patent: 5-96581 (1993-04-01), None
patent: 5-278043 (1993-10-01), None
patent: 6-198685 (1994-07-01), None
patent: 7-68604 (1995-03-01), None
patent: 7-68605 (1995-07-01), None
patent: 11-192642 (1999-07-01), None
patent: 2000-317995 (2000-11-01), None
patent: 442373 (2001-06-01), None
English abstract for JP 4-195743.
Computer translation of JP 6-198685.
Computer translation of JP 7-68605.
Patent Abstracts of Japan, JP 06-198685, Jul. 19, 1994.
Patent Abstracts of Japan, JP 07-068605, Mar. 14, 1995.
Minemura Ken
Nakano Jun
Shimizu Jun
Heckenberg Donald
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Sony Corporation
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