Dishing avoidance in wide soft metal wires

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29827, 29846, H01K 310

Patent

active

060948124

ABSTRACT:
A method of manufacturing semiconductor circuits or electronic packages is provided. The step of splitting up wide metal areas into metal stripes is included into the physical design step of such devices. This method does not increase the data complexity significantly and guarantees correctness of the design. Furthermore, the method allows to solve the dishing problem that is inherent to copper wiring technologies.

REFERENCES:
patent: 5678301 (1997-10-01), Gochnour et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Dishing avoidance in wide soft metal wires does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dishing avoidance in wide soft metal wires, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dishing avoidance in wide soft metal wires will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-652186

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.